File:B-ad-crosssectionbcb.png
Summary
| Description |
English: Cross-sectional view of bonded wafer pair with an intermediate BCB layer width of 100 µm |
| Date | (UTC) |
| Source | M. Wiemer and C. Jia and M. Töpper and K. Hauck, Wafer Bonding with BCB and SU-8 for MEMS Packaging (2006) |
| Author | Fraunhofer ENAS, D. Neumann |
Licensing
This file is licensed under the Creative Commons Attribution-Share Alike 3.0 Germany license.
- You are free:
- to share – to copy, distribute and transmit the work
- to remix – to adapt the work
- Under the following conditions:
- attribution – You must give appropriate credit, provide a link to the license, and indicate if changes were made. You may do so in any reasonable manner, but not in any way that suggests the licensor endorses you or your use.
- share alike – If you remix, transform, or build upon the material, you must distribute your contributions under the same or compatible license as the original.
Original upload log
Transferred from en.wikipedia to Commons by Josve05a using CommonsHelper.
The original description page was here. All following user names refer to en.wikipedia.
- 2011-03-30 11:17 Enaswiki 3476×2805× (1516697 bytes) {{Information |Description = Cross-sectional view of bonded wafer pair with an intermediate BCB layer width of 100 µm |Source = M. Wiemer and C. Jia and M. Töpper and K. Hauck, Wafer Bonding with BCB and SU-8 for MEMS Packaging (2006)