File:B-gf-crosssectionsemizm.png

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Upload date 2011-12-27T12:28:25Z
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Summary

Description
Deutsch: Rasterelektronenmikroskop-Bild des Querschnitts zweier mittels Glaslotes (matrix, mit einem Keramik-Füllstoff, filler) verbundenen Siliziumwafers (Si), von Fraunhofer IZM.
Français : Vue par microscopie électronique à balayage (MEB) d'une section transverse de deux plaquettes (waters) de silicium (Si), assemblés par un verre de scellement (matrix) chargé de particules céramiques (filler) ; du Fraunhofer IZM.
Date
Source M. Petzold and C. Dresbach and M. Ebert and J. Bagdahn and M. Wiemer and K. Glien and J. Graf and R. Müller-Fiedler and H. Höfer, Fracture mechanical life-time investigation of glass frit-bonded sensors (2006)
Author

Fraunhofer ENAS, D. Neumann

Uploaded by Enaswiki at en.wikipedia

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  • 2011-03-30 11:34 (UTC) | Enaswiki | 292263 (bytes) | 1501×1164 | {{Information |Description = Microscopic cross sectional SEM images of glass frit bonded silicon wafers from Fraunhofer IZM. |Source = M. Petzold and C. Dresbach and M. Ebert and J. Bagdahn and M. Wiemer and K. Glien and J. Graf and R. Mülle

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Category:CC-BY-SA-3.0-DE Category:Files moved from en.wikipedia to Commons requiring review as of 27 December 2011 Category:Manufacture of electronics Category:Microtechnology Category:Packaging Category:Semiconductors Category:Wafer bonding