File:B-e-crosssectionsemofbondinginterface.png

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Category:Files moved from en.wikipedia to Commons requiring review as of 27 December 2011#B-e-crosssectionsemofbondinginterface.png

Summary

Description
English: Cross-section SEM image of the eutectic bonding interface between Si and Au with 80.3 Si atom percentage.
Date
Source Y.-C. Lin and M. Baum and M. Haubold and J. Frömel and M. Wiemer and T. Gessner and M. Esashi, Development and evaluation of AuSi eutectic wafer bonding (2009)
Author

Fraunhofer ENAS, D. Neumann

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Category:CC-BY-SA-3.0-DE#B-e-crosssectionsemofbondinginterface.png

Original upload log

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  • 2011-03-30 11:24 (UTC) | Enaswiki | 1179049 (bytes) | 1694×1153 | {{Information |Description = Cross-section SEM image of the eutectic bonding interface between Si and Au with 80.3 Si atom percentage. |Source = Y.-C. Lin and M. Baum and M. Haubold and J. Frömel and M. Wiemer and T. Gessner and M. Esashi, D
Category:Manufacture of electronics Category:Microtechnology Category:Packaging Category:Semiconductors Category:Wafer bonding
Category:CC-BY-SA-3.0-DE Category:Files moved from en.wikipedia to Commons requiring review as of 27 December 2011 Category:Manufacture of electronics Category:Microtechnology Category:Packaging Category:Semiconductors Category:Wafer bonding